4layer BT material Sip Packaging Substrate Semiconductor package

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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4layer BT material Sip Packaging Substrate Semiconductor package

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4layer BT material Sip Packaging Substrate Semiconductor package

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -...

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MSAP Sip Packaging Substrate

BT Sip Packaging Substrate

4layer CSP Semiconductor Substrate

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