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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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6 Years

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FBGA Package substrate production supporting BT 40um core

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FBGA Package substrate production supporting BT 40um core

FBGA Package substrate production supporting BT 40um core

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronic...

Product Tags:

4 Layer Flip Chip Substrate

      

BGA Package Chip Substrate

      

BT Core FCBGA Substrate

      
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